Name: CVD 다이아몬드 히트 싱크 칩은 첨단 패키지에서 열 분비를 촉진합니다.
Uploaded: 2026-01-07CST00:12:06-06:00
Duration: 53 s
Description: Discover how Single Crystal CVD Diamond Substrate chips enhance heat dissipation in advanced packaging. Available in sizes 7x7, 8x8, 9x9, and 10x10mm, these lab-grown diamond seeds offer superior thermal conductivity of 1500W/MK for high-power electronic components.

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CVD 다이아몬드 히트 싱크 칩은 첨단 패키지에서 열 분비를 촉진합니다.

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September 15, 2025

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Video Description:

Discover how Single Crystal CVD Diamond Substrate chips enhance heat dissipation in advanced packaging. Available in sizes 7x7, 8x8, 9x9, and 10x10mm, these lab-grown diamond seeds offer superior thermal conductivity of 1500W/MK for high-power electronic components.